Laird Technologies' Tgon 800 is a high performance, cost effective thermal interface material. Tgon 800 is ideal where electrical contact and thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the X-Y plane and 5 W/mK through the Z-axis.
The Tgon 800 series is available in 12 x 18-inch (305mm x 457mm) sheets. It is also available with proprietary pressure sensitive adhesive on one side. This adhesive coating is one of the thinnest available at 0.5 mil, minimizing the impact on thermal performance.
