SEARAY™ is a .050” high density, high speed board-to-board interconnect system. The SEAM/SEAF Series open pin field array configuration allows maximum routing and design flexibility. SEARAY™ can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 5 GHz per pin (at -3dB insertion loss).
The contacts in the SEARAY™ system are robust and allow for “zippering” when mating and unmating the connectors. The Edge Rate™ contact lowers insertion and extraction forces, an important consideration given SEARAY™ is available with up to 500 I/Os. SEARAY™ is available in stack heights from 7mm to 17.5mm.
SEARAY™ utilizes Samtec’s patent pending solder charge technology to simplify IR reflow termination and improve solder joint reliability. The advantage of this technology, compared to standard BGA/solder ball attachment, is that the interconnects are subjected to extreme heat only once during assembly of the connector to the PCB (as opposed to twice with solder ball attach methods). This becomes more relevant with the higher temperatures required for lead-free processing. SEARAY™ is currently available with a tin-lead solder crimp as well as a lead-free tin alloy solder charge, which is ROHS compliant.
